Reliability Test Service

CDK supports the development and quality maintenance of customers by reliability technique cultivated by semiconductor production. Our laboratory is possible to test not only specified condition (JEDEC,JIS,JEITA) but also customized condition. In addition, we can manufacture a test fixture, measure electrical character, visual inspection and so on.

Test Name	Test Code	Outline	Related Standard
High Temperature Storage	HTS	To evaluate durability rapidly by raising temperature.	・JEITA ED-4701 ・JIS 60068-2 （IEC 60068-2) ・MIL-STD-202/750/883
Temperature Humidity Storage	THS	To evaluate durability rapidly by raising temperature and humidity.
High Temperature Operating Life	HTOL	To evaluate durability rapidly by increasing operation voltage at high temperature.
High Temperature Reverse Bias	HTRB	To evaluate durability rapidly by increasing reverse-voltage at high temperature.
High Temperature Forward Bias	HTFB	To evaluate durability rapidly by increasing forward-voltage at high temperature.
Temperature Humidity Bias	THB	To evaluate durability rapidly by increasing operation voltage at high temperature and humidity.
Temperature Cycle(air)	TC	To evaluate durability by changing temperature suddenly.
HAST	PCT PCBT	To evaluate durability at highly accelerated temperature and humidity with high pressures.
IR Reflow Simulator	－	To simulate influence when soldering.

We can test at customized conditions as well as at specified conditions
(JEDEC, JIS, JEITA).

Test Detail

High Temperature Storage Test

Purpose	To evaluate durability rapidly by raising temperature.
Method	Testing during specified period by using constant temperature chamber. Temperature range 50℃ to 550℃ Atmosphere gas N2 Chamber size 450(W) x 450(D) x 450(H) mm
Equipment	NE-112 (ROBERT) STPH-101 (ESPEC)

Temperature Humidity Storage Test

Purpose	To evaluate durability rapidly by raising temperature and humidity
Method	Testing during specified period by using constant temperature and constant humidity chamber. Temperature range RT up to 100℃ Humidity range 20% to 98% Chamber size 500(W) x 380(D) x 630(H) mm
Equipment	EC-15HHP (HITACHI)

High Temperature Operating Life

Purpose	To evaluate durability rapidly by increasing operation voltage at high temperature..
Method	Testing during specified period by using constant temperature chamber. Temperature range RT up to 200℃ Voltage range 0V to 25V Chamber size 500(W) x 380(D) x 630(H) mm
Equipment	EH-144 (IMAI DENKI) NE-110,NE-110A(ROBERT)

High Temperature Reverse / Forward Bias Test

Purpose	To evaluate durability rapidly by increasing reverse-voltage or forward-voltage at high temperature.
Method	Testing during specified period by using constant temperature chamber. Temperature range RT up to 200℃ Voltage range 0V to 25V Chamber size 500(W) x 380(D) x 630(H) mm
Equipment	EH-144 (IMAI DENKI) NE-110,NE-110A(ROBERT)

Purpose

To evaluate durability rapidly by increasing reverse-voltage or forward-voltage at high temperature.

Method

Testing during specified period by using constant temperature chamber.

Temperature range RT up to 200℃
Voltage range 0V to 25V
Chamber size 500(W) x 380(D) x 630(H) mm

Equipment

EH-144 (IMAI DENKI)
NE-110,NE-110A(ROBERT)

Temperature Humidity Bias Test

Purpose	To evaluate durability rapidly by increasing operation voltage at high temperature and humidity.
Method	Testing during specified period by using constant temperature and constant humidity chamber. Temperature range 70℃ to 90℃ Humidity range 60% to 95% Voltage range up to 25V
Equipment	NTHB-1000B (CHUOURIKEN)

Temperature Cycle Test (air)

Purpose	To evaluate durability by changing temperature suddenly.
Method	Testing during specified cycles by using chamber capable of controlling high/low temperature. Low temperature range -70℃ to 0℃ High temperature range 60℃ to 200℃ Chamber size 390(W)×390(D)×460(H) mm 　　　　　　　470(W)×485(D)×460(H) mm
Equipment	ES-76LM,ES-106LHH (HITACHI)

HAST(PCT,PCBT)

Purpose	To evaluate durability at highly accelerated temperature and humidity with high pressures.
Method	Testing during specified period by using pressure cooker chamber. Temperature range 105℃ to 162.2℃ Humidity range 75% to 100 % Chamber size φ340×475(D) mm
Equipment	EHS-411MD (ESPEC) PC422R7 (HIRAYAMA) PC422R8D(HIRAYAMA)

IR Reflow Simulator

Purpose	To simulate influence when soldering.
Method	Testing during specified period and temperature by using reflow simulator. temperature range up to 330℃ Chamber size 330(W) x 250(D) x 15(H) mm *Have to make profile before testing.
Equipment	RDT-250C(MALCOM)

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