CDK ‘s own manufacturing know-how and rich experience on RF device packaging enables a production that to meet the needs of customers.
Additionally, it conforms to environmental regulation. (RoHS, lead-free etc.)
Wafer Processing Technology
・Process both Si (blade dicing) and GaAs Wafer(scribe and breaking) with high yield ratio.
・Visual inspection automatically.
- Wafer Size
- MAX: 8inchφ
- Wafer Material
- Si/GaAs
Automated GaAs Wafer scriber
Automatic Visual Inspection
Die Attach Technology
・The die attach process uses AuSi , pastes or solders.
・Thin and small die attached with high accuracy.
- Die Size
- Min:0.27×0.23ｍｍ/Max:5.7×1.0ｍｍ
- Accuracy
- ｘ:±38um/ｙ:±38um
- Adhesive
- Ag paste / AuSn solder / PbSn solder
GaAs die attach process
Hoop-line
Hoop-line
Wire Bonding Technology
・Using NTC bonding process.
・Small diameter wire (Au, Ag, Cu) using.
| Wire | Au | Pb-Cu |
| Diameter | 18um to 38um | 20um |
| Accuracy | ｘ:±2.5um/ｙ:2.5um |
Wire Bonder
Hollow Packaging Technology
・Full-mold, dual mold and hollow package.
・Supply with maximum RF characteristic and low-cost production.
・Supply with maximum RF characteristic and low-cost production.
Cross-section View
