Reliability Test Service

CDK supports the development and quality maintenance of customers by reliability technique cultivated by semiconductor production. Our laboratory is possible to test not only specified condition (JEDEC,JIS,JEITA) but also customized condition. In addition, we can manufacture a test fixture, measure electrical character, visual inspection and so on.

Test Name Test
Code
Outline Related
Standard
High Temperature Storage HTS To evaluate durability rapidly by raising temperature. ・JEITA ED-4701
・JIS 60068-2
(IEC 60068-2)
・MIL-STD-202/750/883
Temperature Humidity Storage THS To evaluate durability rapidly by raising temperature and humidity.
High Temperature Operating Life HTOL To evaluate durability rapidly by increasing operation voltage at high temperature.
High Temperature Reverse Bias HTRB To evaluate durability rapidly by increasing reverse-voltage at high temperature.
High Temperature Forward Bias HTFB To evaluate durability rapidly by increasing forward-voltage at high temperature.
Temperature Humidity Bias THB To evaluate durability rapidly by increasing operation voltage at high temperature and humidity.
Temperature Cycle(air) TC To evaluate durability by changing temperature suddenly.
HAST PCT
PCBT
To evaluate durability at highly accelerated temperature and humidity with high pressures.
IR Reflow Simulator To simulate influence when soldering.
Salt Spray Test(*) SST To evaluate durability by salt mist.
Electro Static Discharge Test(*) ESD To evaluate influence by electrostatic discharge.
Latch-up Test(*) To evaluate Latch-up sensibility.

(*) Those tests are outsourcing.

We can test at customized conditions as well as at specified conditions
(JEDEC, JIS, JEITA).

Test Detail

High Temperature Storage Test

Purpose To evaluate durability rapidly by raising temperature.
Method Testing during specified period by using constant temperature chamber.
  • Temperature range 50℃ to 550℃
  • Atmosphere gas N2
  • Chamber size 450(W) x 450(D) x 450(H) mm
Equipment
  • NE-112 (ROBERT)
  • STPH-101 (ESPEC)

Temperature Humidity Storage Test

Purpose To evaluate durability rapidly by raising temperature and humidity
Method Testing during specified period by using constant temperature and constant humidity chamber.
  • Temperature range RT up to 100℃
  • Humidity range 20% to 98%
  • Chamber size 500(W) x 380(D) x 630(H) mm
Equipment
  • EC-15HHP (HITACHI)

High Temperature Operating Life

Purpose To evaluate durability rapidly by increasing operation voltage at high temperature..
Method Testing during specified period by using constant temperature chamber.
  • Temperature range RT up to 200℃
  • Voltage range 0V to 25V
  • Chamber size 500(W) x 380(D) x 630(H) mm
Equipment
  • EH-144 (IMAI DENKI)
  • NE-110,NE-110A(ROBERT)

High Temperature Reverse / Forward Bias Test

Purpose

To evaluate durability rapidly by increasing reverse-voltage or forward-voltage at high temperature.

Method Testing during specified period by using constant temperature chamber.
  • Temperature range RT up to 200℃
  • Voltage range 0V to 25V
  • Chamber size 500(W) x 380(D) x 630(H) mm
Equipment
  • EH-144 (IMAI DENKI)
  • NE-110,NE-110A(ROBERT)

Temperature Humidity Bias Test

Purpose To evaluate durability rapidly by increasing operation voltage at high temperature and humidity.
Method Testing during specified period by using constant temperature and constant humidity chamber.
  • Temperature range 70℃ to 90℃
  • Humidity range 60% to 95%
  • Voltage range up to 25V
Equipment
  • NTHB-1000B (CHUOURIKEN)

Temperature Cycle Test (air)

Purpose To evaluate durability by changing temperature suddenly.
Method Testing during specified cycles by using chamber capable of controlling high/low temperature.
  • Low temperature range -70℃ to 0℃
  • High temperature range 60℃ to 200℃
  • Chamber size 390(W)×390(D)×460(H) mm
           470(W)×485(D)×460(H) mm
Equipment
  • ES-76LM,ES-106LHH (HITACHI)

HAST(PCT,PCBT)

Purpose To evaluate durability at highly accelerated temperature and humidity with high pressures.
Method Testing during specified period by using pressure cooker chamber.
  • Temperature range 105℃ to 162.2℃
  • Humidity range 75% to 100 %
  • Chamber size φ340×475(D) mm
Equipment
  • EHS-411MD (ESPEC)
  • PC422R7 (HIRAYAMA)
  • PC422R8D(HIRAYAMA)

IR Reflow Simulator

Purpose To simulate influence when soldering.
Method Testing during specified period and temperature by using reflow simulator.
  • temperature range up to 330℃
  • Chamber size 330(W) x 250(D) x 15(H) mm
*Have to make profile before testing.
Equipment
  • RDT-250C(MALCOM)
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Reliability Test Service