Reliability Test Service | Evaluation & Analysis|Chuo Denshi Kogyo Co., Ltd. - CDK

Evaluation & Analysis

CDK offers wide range of evaluation and analysis to meet our customers' needs.
We provide the immediate & flexible service such as electrical measurement, visual inspection (x-ray, SEM, EDS…), chemical etch and so on.

Stereomicroscope Metallgraph Digital Microscope SEM Fluorescence X-ray Laser Microscope EDS X-ray Ion Milling Chemical Etching

Observing Equipment

Stereomicroscope

Purpose Expanding the observation image by stereomicroscope.
Method
  • Magnification rate X 7 to 90
  • Lighting Ring type / Coaxial lighting type
    *Polarization observation(λ/4) is possible by using the coaxial lighting.
Equipment
  • OPTIPHOT 150 (NIKON) ,etc.

Metallograph

Purpose Expanding the observation image by metallograph.
Method
  • Magnification rate X 20 to 5000
  • Lighting Coaxial lighting type
Equipment
  • SZX12 (OLYMPUS) ,etc.

Digital Microscope

Purpose Expanding the observation image by digital microscope.
Method
  • Magnification rate X 20 to 5000
  • Lighting Ring type / Coaxial lighting type
Equipment
  • VHX-500 (KEYENCE)

Measuring Equipment

Laser Microscope

Laser Microscope
Purpose Observing the image by scanning the laser.
Method
  • Depth resolution 0.01 um
  • Width resolution 0.01 um
Equipment
  • VHX-8710 (KEYENCE)

X-ray Fluorescence Thickness Meter

X-ray Fluorescence Thickness Meter
Purpose Measuring thickness and elemental ratio of films.
Method
  • Ag/Cu
  • Ag/Ni
  • Au/Ni
Equipment
  • XDVM-W (FISCHER)

Inside Inspection

X-ray Analysis Equipment

X-ray Analysis Equipment
Purpose Taking the fluoroscopic image to observe the inside.
Method
  • Tube voltage MAX 90 kV
  • Tube current MAX 0.1 uA
  • Table size 250 X 330 mm
Equipment
  • WL-90 (SOFTEX)

IComponent Analysis

SEM/EDS

SEM/EDS
Purpose Taking the image and analyzing the component.
Method
  • Acceleration voltage 0.5kV to 30kV
  • Minimum resolution 4.0 nm
  • Stage size 80 X 40 mm
Equipment
  • SEM:JSM-6380(JEOL)
  • EDS:JED-2300(JEOL)

ex)component analysis by EDS: interface of solder

ex)component analysis by EDS: interface of solder

Device Processing

Ion Milling

Ion Milling
Purpose Polishing the surface of the device by noble gas beam.
Method
  • Acceleration voltage 2kV to 6kV
  • Beam diameter from 500 um/li
  • Sample size 11 X 10 X 2 mm/li
    *As processible size is tiny, it may be necessary to do precutting.
Equipment
  • IB-09010CP (EOL)

Chemical Etching

Purpose Etching the plastic package by using mixed acid.
Method By difference of plastic composition, the state of dissolving is different. so it may be necessary to do pretest. Please ask us in advance.
Contact us
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+81-964-32-2750

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Reliability Test Service