CDK ‘s own manufacturing know-how and rich experience on RF device packaging enables a production that to meet the needs of customers.
Additionally, it conforms to environmental regulation. (RoHS, lead-free etc.)
Wafer Processing Technology
・Process both Si (blade dicing) and GaAs Wafer(scribe and breaking) with high yield ratio.
・Visual inspection automatically.
- Wafer Size
- MAX: 8inchφ
- Wafer Material
Automatic Visual Inspection
Die Attach Technology
・The die attach process uses AuSi , pastes or solders.
・Thin and small die attached with high accuracy.
- Die Size
- Ag paste / AuSn solder / PbSn solder
Wire Bonding Technology
・Using NTC bonding process.
・Small diameter wire (Au, Ag, Cu) using.
|Diameter||18um to 38um||20um|
Hollow Packaging Technology
・Supply with maximum RF characteristic and low-cost production.