RF Semiconductors OSAT

With over 40 years of packaging, assembly and testing experience, CDK truly supports customers.

Process Flow

  1. Front end
  2. Wafe
    Processing
  3. Die
    Attach
  4. Wire
    Bonding
  5. Hollow
    Packaging
  6. Testing
  7. Taping

Package lineup

CDK offers a wide range of package lineup, with over 40 years of RF products mass production.
So-called Hollow packages are based on our own production technology.

Assembly Technology

Assembly Technology

CDK offers a wide range of package lineup.
We always provide Japan quality assembly solution for customers.

Testing Technology

Testing Technology

CDK has a wide range of RF test equipments.
We always provide Japan quality testing solution for customers.

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+81-964-32-2750

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RF Semiconductors OSAT